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vidal31 library [136 articles]

最近 vidal31 さんのライブラリ .
  • Making real money in virtual worlds: MMORPGs and emerging business opportunities, challenges and ethical implications in metaverses
    Technological Forecasting and Social Change, Vol. In Press, Corrected Proof
    by Savvas Papagiannidis, Michael Bourlakis, Feng Li
    posted to currency mmorpg money virtual by vidal31 on 2008-01-23 16:27:50 as **
  • notes Fatigue and Intermetallic Formation in Lead Free Solder Die Attach
    (9-13 July 2001)
    by P Mccluskey
    edited by "proceedings
    posted to lead-free by vidal31 on 2007-07-18 12:50:13 as **
  • Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder - GEIA-STD-0005-1
    posted to lead-free by vidal31 on 2007-07-18 10:46:19 as **
  • notes Solder Paste Evaluation Techniques for Pb-Free
    posted to lead-free by vidal31 on 2007-07-13 13:11:33 as **
  • notes Lead-free Controlling Tombstoning Behavior
    posted to lead-free by vidal31 on 2007-07-13 13:09:10 as **
  • notes Eliminate Lead-free Wave Soldering
    posted to lead-free by vidal31 on 2007-07-13 13:07:07 as **
  • Development of a lead free chip scale package for wireless applications
    Electronic Components and Technology Conference, 2001. Proceedings., 51st (2001), pp. 665-670.
    by V Kripesh, Poi-Siong Teo, CT Tai, G Vishwanadam, Yew C Mui
    posted to lead-free by vidal31 on 2007-07-13 12:57:27 as **
  • C4NP as a High-Volume Manufacturing Method for Fine-Pitch and Lead-Free FlipChip Solder Bumping
    Electronics Systemintegration Technology Conference, 2006. 1st, Vol. 1 (2006), pp. 518-524.
    by Eric Laine, Klaus Ruhmer, Eric Perfecto, Hai Longworth, David Hawken
    posted to lead-free by vidal31 on 2007-07-13 11:45:03 as **
  • Understanding the process window for printing lead-free solder pastes
    Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 24, No. 4. (2001), pp. 249-254.
    by TA Nguty, B Salam, R Durairaj, NN Ekere
    posted to lead-free by vidal31 on 2007-07-13 11:43:03 as **
  • Lead free interfacial structures and their relationship to Au plating including accelerated thermal cycle testing of non-leaden BGA spheres
    Electronic Components and Technology Conference, 2001. Proceedings., 51st (2001), pp. 675-680.
    by T Taguchi, R Kato, S Akita, A Okuno, H Suzuki, T Okuno
    posted to lead-free by vidal31 on 2007-07-13 11:36:31 as **
  • Process optimization of lead-free wafer-level underfill material used in chip scale packaging
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on (2005), pp. 293-297.
    by Y Liu, G Dutt, A Xiao
    posted to lead-free by vidal31 on 2007-07-13 10:52:59 as **
  • TBGA substrate for lead-free and halogen-free applications
    Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the (2004), pp. 45-49.
    by CQ Cui, K Pun
    posted to lead-free by vidal31 on 2007-07-13 10:50:34 as **
  • Microstructure and mechanical properties investigation of lead-free solder Sn/sub 99.3/Cu/sub 0.7/
    Electronic Packaging Technology, 2005 6th International Conference on (2005), pp. 466-470.
    by Fulong Zhu, Honghai Zhang, Rongfeng Guan, Sheng Liu
    posted to lead-free by vidal31 on 2007-07-13 10:48:35 as **
  • Are you ready for lead-free electronics?
    Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on], Vol. 28, No. 4. (2005), pp. 884-894.
    by V Eveloy, S Ganesan, Y Fukuda, Ji Wu, MG Pecht
    posted to lead-free by vidal31 on 2007-07-13 10:45:57 as **
  • Challenges in converting to lead-free electronics
    Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd (2000), pp. 6-9.
    by CM Garner, V Gupta, V Bissessur, A Kumar, R Aspandiar
    posted to lead-free by vidal31 on 2007-07-13 10:43:36 as **
  • Wave Soldering Using Sn/3.0Ag/0.5Cu Solder and Water Soluble VOC-Free Flux
    Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 29, No. 3. (2006), pp. 202-210.
    by G Wable, Q Chu, P Damodaran, K Srihari
    posted to lead-free by vidal31 on 2007-07-13 10:41:27 as **
  • Research on failure modes of BGA assemblies with lead-free solder on different PCB materials
    Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on (2003), pp. 396-400.
    by Fangjuan Qi, Jim Liu
    posted to lead-free by vidal31 on 2007-07-13 10:39:38 as **
  • Lead-free chip scale packages: assembly and drop test reliability
    Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 29, No. 1. (2006), pp. 1-9.
    by Yueli Liu, Guoyun Tian, S Gale, RW Johnson, L Crane
    posted to lead-free by vidal31 on 2007-07-13 10:37:08 as **
  • Lead-free soldering effect to tantalum capacitors
    Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on (2003), pp. 85-89.
    by T Zednicek, P Vasina, Z Sita, B Vrana
    posted to lead-free by vidal31 on 2007-07-13 10:32:26 as **
  • Structure and kinetics of Sn whisker growth on Pb-free solder finish
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd (2002), pp. 628-633.
    by WJ Choi, TY Lee, KN Tu, N Tamura, RS Celestre, AA Macdowell, YY Bong, L Nguyen, GTT Sheng
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:28:59 as **
  • Electrodeposited tin properties & their effect on component finish reliability
    Business of Electronic Product Reliability and Liability, 2004 International Conference on (2004), pp. 29-34.
    by R Schetty
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:27:09 as **
  • Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory
    Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 36-62.
    by JW Osenbach, RL Shook, BT Vaccaro, BD Potteiger, AN Amin, KN Hooghan, P Suratkar, P Ruengsinsub
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:25:41 as **
  • Detection of tin plating and tin whisker mitigation
    Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International (2004), pp. 563-564.
    by WD Bjorndahl, L Singleton, R Griese, F Chong
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:24:06 as **
  • Pb-free plating: a process and solder joint reliability study
    Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th (2004), pp. 162-168.
    by Ming S Ong, Yi M Lau, Ah C Tan
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:22:01 as **
  • Matte tin (Sn) plating: whisker growth study
    Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th (2004), pp. 281-288.
    by A Sriyarunya, J Tondtan, D Bansal
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:20:37 as **
  • Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy
    Electronics Packaging Technology Conference, 2006. EPTC '06. 8th (2006), pp. 398-403.
    by H Sosiati, N Kuwano, S Hata, Y Iwane, Y Morizono, Y Ohno
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:17:51 as **
  • Portable X-ray fluorescence analyzer for the first level screening of materials for prohibited substances
    Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 7-13.
    by S Piorek
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:16:27 as **
  • Lead free packaging and Sn-whiskers
    Electronic Components and Technology Conference, 2004. Proceedings. 54th, Vol. 2 (2004), pp. 1314-1324 Vol.2.
    by JW Osenbach, RL Shook, BT Vaccaro, BD Potteiger, A Amin, P Ruengsinsub
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:14:52 as **
  • Carbon Nanotube Filled Conductive Adhesives for Aerospace Applications
    Aerospace Conference, 2007 IEEE (2007), pp. 1-6.
    by Jing Li, Janet K Lumpp
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:13:16 as **
  • The Sn Whisker Growth Evolution of IC Packaging on the PC Board Assembly
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th (2007), pp. 1964-1970.
    by Jeffrey C Lee, PC Chen, CG Tyan
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:11:28 as **
  • Behavior of whisker growth on tin plated Fe-42%Ni substrates
    Electronics Packaging Technology Conference, 2006. EPTC '06. 8th (2006), pp. 150-153.
    by Y Iwane, Y Morizono, Y Ohno, N Kuwano
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:09:58 as **
  • PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement
    Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International (2004), pp. 40-44.
    by JD Kim, WS Choi, KS Park, EH Kim, SB Lee, HG Kim
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:08:08 as **
  • Whisker test methods of JEITA whisker growth mechanism for test methods
    Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 10-16.
    by I Sakamoto
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:06:27 as **
  • Characterization study of lead-free Sn-Cu plated packages
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd (2002), pp. 1238-1245.
    by JCB Lee, Yung-Ling Yao, Fang-Yi Chiang, PJ Zheng, CC Liao, YS Chou
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:04:52 as **
  • Lessons learnt from lead-free soldering implementation - real example
    Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 42-50.
    by WM Cheng, HY Wu
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:02:48 as **
  • Role of intrinsic stresses in the phenomena of tin whiskers in electrical connectors
    Electronics Packaging Manufacturing, IEEE Transactions on, Vol. 28, No. 1. (2005), pp. 63-74.
    by S Lal, TD Moyer
    posted to lead-free whiskers by vidal31 on 2007-07-13 10:01:10 as **
  • Transition to lead free soldering - a great change for a better understanding of materials and processes and green electronics
    Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on (2005), pp. 33-36.
    by J Mueller, H Griese, K Schischke, L Stobbe
    posted to lead-free whiskers by vidal31 on 2007-07-13 09:59:47 as **
  • Nano nickel-tin interconnects and electrodes for next generation 15 micron pitch embedded bio fluidic sensors in FR4 substrates
    Electronic Components and Technology Conference, 2006. Proceedings. 56th (2006), 3 pp..
    by R Doraiswami
    posted to lead-free whiskers by vidal31 on 2007-07-13 09:57:40 as **
  • Lead-free plating for semiconductor devices qualification & implementation
    Electronics Packaging Technology, 2003 5th Conference (EPTC 2003) (2003), pp. 59-64.
    by A Sriyarunya, R Schetty
    posted to lead-free whiskers by vidal31 on 2007-07-13 09:50:16 as **
  • Manufacturability and reliability of lead-free package
    Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the (2004), pp. 105-109.
    by A Sriyarunya
    posted to lead-free whiskers by vidal31 on 2007-07-13 09:45:39 as **
  • Analysis of Lead Free Tin Whisker Test Methodology and Characterization
    ROCS Workshop, 2006. [Reliability of Compound Semiconductors] (2006), pp. 41-54.
    by Helen Cui, Mike Ferrara, Matthew Mlcak
    posted to lead-free whiskers by vidal31 on 2007-07-13 09:41:47 as **
  • Lead-free semiconductor packaging
    Electronics Packaging Technology Conference, 2002. 4th (2002), pp. 11-19.
    by CCM Beelen-Hendrikx, J Klerk, JT van der Water
    posted to lead-free whiskers by vidal31 on 2007-07-13 09:37:39 as **
  • Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method - MIL-P-15736/4
    posted to lead-free by vidal31 on 2007-07-13 08:38:38 as **
  • GLASS, POTASH SODA BARIUM, LEAD-FREE COMPRESSION SEALING (NO S/S DOCUMENT) - MIL-G-47032A NOT 1
    posted to lead-free by vidal31 on 2007-07-13 08:38:01 as **
  • Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components (FOREIGN STANDARD) - JIS Z 3198-7:2003
    posted to lead-free by vidal31 on 2007-07-13 08:37:17 as **
  • Test methods for lead-free solders -- Part 6: Methods for 45opull test of solder joints on QFP lead (FOREIGN STANDARD) - JIS Z 3198-6:2003
    posted to lead-free by vidal31 on 2007-07-13 08:36:40 as **
  • Test methods for lead-free solders -- Part 5: Methods for tensile tests and shear tests on solder joints (FOREIGN STANDARD) - JIS Z 3198-5:2003
    posted to lead-free by vidal31 on 2007-07-13 08:36:06 as **
  • Test methods for lead-free solders -- Part 4: Methods for solderbility test by a wetting balance method and a contact angle method (FOREIGN STANDARD) - JIS Z 3198-4:2003
    posted to lead-free by vidal31 on 2007-07-13 08:35:26 as **
  • Test methods for lead-free solders -- Part 3: Methods for spread test (FOREIGN STANDARD) - JIS Z 3198-3:2003
    posted to lead-free by vidal31 on 2007-07-13 08:34:43 as **
  • Test methods for lead-free solders -- Part 2: Methods for testing of mechanical characteristics-tensile test (FOREIGN STANDARD) - JIS Z 3198-2:2003
    posted to lead-free by vidal31 on 2007-07-13 08:34:04 as **
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