Self-assembled single-crystal silicon circuits on plastic

@article{citeulike:949370, abstract = {We demonstrate the use of self-assembly for the integration of freestanding micrometer-scale components, including single-crystal, silicon field-effect transistors (FETs) and diffusion resistors, onto flexible plastic substrates. Preferential self-assembly of multiple microcomponent types onto a common platform is achieved through complementary shape recognition and aided by capillary, fluidic, and gravitational forces. We outline a microfabrication process that yields single-crystal, silicon FETs in a freestanding, powder-like collection for use with self-assembly. Demonstrations of self-assembled FETs on plastic include logic inverters and measured electron mobility of 592 cm2/V-s. Finally, we extend the self-assembly process to substrates each containing 10,000 binding sites and realize 97\% self-assembly yield within 25 min for 100-{micro}m-sized elements. High-yield self-assembly of micrometer-scale functional devices as outlined here provides a powerful approach for production of macroelectronic systems. 10.1073/pnas.0602893103}, author = {Stauth, Sean A. and Parviz, Babak A. }, citeulike-article-id = {949370}, comment = {Functional, self-assembled circuits on a flexible plastic substrate}, journal = {PNAS}, keywords = {flexible-electronics, macroelectronics, self-assembly}, month = {September}, number = {38}, pages = {13922--13927}, posted-at = {2006-11-16 19:53:00}, priority = {2}, title = {Self-assembled single-crystal silicon circuits on plastic}, url = {http://www.pnas.org/cgi/content/abstract/103/38/13922}, volume = {103}, year = {2006} }

TY - JOUR ID - citeulike:949370 L3 - citeulike-article-id:949370 TI - Self-assembled single-crystal silicon circuits on plastic JF - PNAS VL - 103 IS - 38 SP - 13922 EP - 13927 N2 - We demonstrate the use of self-assembly for the integration of freestanding micrometer-scale components, including single-crystal, silicon field-effect transistors (FETs) and diffusion resistors, onto flexible plastic substrates. Preferential self-assembly of multiple microcomponent types onto a common platform is achieved through complementary shape recognition and aided by capillary, fluidic, and gravitational forces. We outline a microfabrication process that yields single-crystal, silicon FETs in a freestanding, powder-like collection for use with self-assembly. Demonstrations of self-assembled FETs on plastic include logic inverters and measured electron mobility of 592 cm2/V-s. Finally, we extend the self-assembly process to substrates each containing 10,000 binding sites and realize 97% self-assembly yield within 25 min for 100-{micro}m-sized elements. High-yield self-assembly of micrometer-scale functional devices as outlined here provides a powerful approach for production of macroelectronic systems. 10.1073/pnas.0602893103 KW - flexible-electronics KW - macroelectronics KW - self-assembly N1 - Functional, self-assembled circuits on a flexible plastic substrate AU - Stauth, Sean AU - Parviz, Babak PY - 2006/09/19/ UR - http://www.pnas.org/cgi/content/abstract/103/38/13922 ER -