Design considerations for single package radio/spl trade/ (SPR) solution for EGSM/DCS dual band cellular phones

by: M Megahed, E Ngompe, M Ayvazian, M Glasbrener

Microwave Symposium Digest, 2003 IEEE MTT-S International, Vol. 3 (2003), pp. 1707-1710 vol.3.

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Abstract

A fully integrated front end radio on SPR, that provides a hybrid SOC and SIP solution, is presented. The SPR includes DCR transceiver, PA, directional coupler detector and FEM implemented on different die technologies plus discrete SAW, LPF, and diplexer in addition to embedded and discrete SMT components. The module is implemented on a low cost 4-layer MCM laminate substrate and its size is equal to 13/spl times/13/spl times/1.8 mm. The area saving on PCB phone boards by using the SPR is about 1/4 the discrete solution implementation. Results show that the complete radio integration can be successfully integrated on SPR.

@inproceedings{citeulike:2776193, abstract = {A fully integrated front end radio on SPR, that provides a hybrid SOC and SIP solution, is presented. The SPR includes DCR transceiver, PA, directional coupler detector and FEM implemented on different die technologies plus discrete SAW, LPF, and diplexer in addition to embedded and discrete SMT components. The module is implemented on a low cost 4-layer MCM laminate substrate and its size is equal to 13/spl times/13/spl times/1.8 mm. The area saving on PCB phone boards by using the SPR is about 1/4 the discrete solution implementation. Results show that the complete radio integration can be successfully integrated on SPR.}, author = {Megahed, M. and Ngompe, E. and Ayvazian, M. and Glasbrener, M. }, booktitle = {Microwave Symposium Digest, 2003 IEEE MTT-S International}, citeulike-article-id = {2776193}, journal = {Microwave Symposium Digest, 2003 IEEE MTT-S International}, keywords = {design, dual-band, mobile, radio}, pages = {1707--1710 vol.3}, posted-at = {2008-05-09 16:46:30}, priority = {2}, title = {Design considerations for single package radio/spl trade/ (SPR) solution for EGSM/DCS dual band cellular phones}, url = {http://ieeexplore.ieee.org/xpls/abs\_all.jsp?arnumber=1210468}, volume = {3}, year = {2003} }

RIS record

TY - CONF ID - citeulike:2776193 L3 - citeulike-article-id:2776193 TI - Design considerations for single package radio/spl trade/ (SPR) solution for EGSM/DCS dual band cellular phones T2 - Microwave Symposium Digest, 2003 IEEE MTT-S International JF - Microwave Symposium Digest, 2003 IEEE MTT-S International VL - 3 SP - 1707 EP - 1710 vol.3 N2 - A fully integrated front end radio on SPR, that provides a hybrid SOC and SIP solution, is presented. The SPR includes DCR transceiver, PA, directional coupler detector and FEM implemented on different die technologies plus discrete SAW, LPF, and diplexer in addition to embedded and discrete SMT components. The module is implemented on a low cost 4-layer MCM laminate substrate and its size is equal to 13/spl times/13/spl times/1.8 mm. The area saving on PCB phone boards by using the SPR is about 1/4 the discrete solution implementation. Results show that the complete radio integration can be successfully integrated on SPR. KW - design KW - dual-band KW - mobile KW - radio AU - Megahed, M AU - Ngompe, E AU - Ayvazian, M AU - Glasbrener, M PY - 2003/// UR - http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1210468 ER -

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