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タグ: electromigration [12 articles]

Recent papers classified by the tag electromigration.
  • Stable state of interconnect under temperature change and electric current
    Acta Materialia, Vol. 46, No. 11. (1 July 1998), pp. 3725-3732.
    by Z Suo
    posted to electromigration by suopublications on 2006-07-18 21:28:13 as **
  • Electromigration lifetime and critical void volume
    Applied Physics Letters, Vol. 85, No. 20. (2004), pp. 4639-4641.
    by Jun He, Z Suo, TN Marieb, JA Maiz
    posted to electromigration by suopublications on 2006-07-18 22:26:25 as **
  • Precipitate drifting and coarsening caused by electromigration
    Journal of Applied Physics, Vol. 74, No. 9. (1993), pp. 5457-5462.
    by Q Ma, Z Suo
    posted to electromigration by suopublications on 2006-07-18 21:14:02 as **
  • A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
    Journal of the Mechanics and Physics of Solids, Vol. 45, No. 9. (September 1997), pp. 1473-1493.
    by L Xia, AF Bower, Z Suo, CF Shih
    posted to electromigration by suopublications on 2006-07-18 21:27:21 as **
  • Saturated voids in interconnect lines due to thermal strains and electromigration
    Journal of Applied Physics, Vol. 98, No. 7. (2005)
    by Zhen Zhang, Zhigang Suo, Jun He
    posted to electromigration by suopublications on 2006-07-18 22:34:01 as **
  • A simulation of electromigration-induced transgranular slits
    Journal of Applied Physics, Vol. 79, No. 5. (1996), pp. 2394-2403.
    by Weiqing Wang, Z Suo, TH Hao
    posted to electromigration by suopublications on 2006-07-18 21:23:07 as **
  • Statistics of Electromigration Lifetime Analyzed Using a Deterministic Transient Model
    STRESS-INDUCED PHENOMENA IN METALLIZATION: Seventh International Workshop on Stress-Induced Phenomena in Metallization, Vol. 741, No. 1. (2004), pp. 15-26.
    by Jun He, Z Suo
    edited by Paul S Ho, Shefford P Baker, Tomoji Nakamura, Cynthia A Volkert
    posted to electromigration by suopublications on 2006-07-18 22:29:08 as **
  • Electromigration instability: Transgranular slits in interconnects
    Applied Physics Letters, Vol. 64, No. 15. (1994), pp. 1944-1946.
    by Z Suo, W Wang, M Yang
    posted to electromigration by suopublications on 2006-07-18 21:16:01 as **
  • High-resolution determination of the stress in individual interconnect lines and the variation due to electromigration
    Journal of Applied Physics, Vol. 78, No. 3. (1995), pp. 1614-1622.
    by Qing Ma, S Chiras, DR Clarke, Z Suo
    posted to electromigration by suopublications on 2006-07-18 21:20:53 as **
  • Electromigration-induced dislocation climb and multiplication in conducting lines
    Acta Metallurgica et Materialia, Vol. 42, No. 11. (November 1994), pp. 3581-3588.
    by Z Suo
    posted to dislocation electromigration by suopublications on 2006-07-18 21:09:31 as **
  • Cavity and dislocation instability due to electric current
    Journal of the Mechanics and Physics of Solids, Vol. 42, No. 6. (June 1994), pp. 897-911.
    by W Yang, W Wang, Z Suo
    posted to dislocation electromigration by suopublications on 2006-07-18 21:16:33 as **
  • Copper metallization reliability
    Microelectronics Reliability, Vol. 39, No. 11. (November 1999), pp. 1595-1602.
    by JR Lloyd, J Clemens, R Snede
    posted to electromigration by mrsmond on 2008-08-05 16:22:00 as ***
    • 注: このページを引用する時は次のURLでどうぞ: http://www.citeulike.org/tag/electromigration

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