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Gratings of regular arrays and trim exposures for ultralarge scale integrated circuit phase-shift lithography

by: M Fritze, B Tyrrell, D Astolfi, D Yost, P Davis, B Wheeler, R Mallen, J Jarmolowicz, S Cann, D Chan, P Rhyins, C Carney, J Ferri, BA Blachowicz
The 45th international conference on electron, ion, and photon beam technology and nanofabrication, Vol. 19, No. 6. (2001), pp. 2366-2370.


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Current semiconductor technology requires optical lithography to image feature sizes smaller than the exposure tool wavelength. In order to achieve this subwavelength imaging, some form of optical resolution-enhancement technology is required, with phase-shift methods offering the greatest potential enhancement. Major impediments to the wide-scale adoption of this technology have included mask cost, inspectability/repair, and turnaround time. The correction of optical proximity effects, which are typically large in phase-shift techniques, have also been an important issue. In this work, we propose a new type of phase-shift approach utilizing gratings of regular arrays and trim exposures. This method makes use of multiple-exposure phase-shift imaging of dense-only features. Proximity effects can be nearly eliminated along with the complex optical proximity corrections typically required on the mask. The simple phase-shift masters can also be reused for multiple designs, thereby addressing cost and turnaround time issues. ©2001 American Vacuum Society.


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